Test Analysis & Equipment Utilization

Failure Analysis Service

Nondestructive Analysis

X-Ray Inspection System

X-ray is a form of electromagnetic radiation with a short wavelength and easily penetrates an object owing to its high energy. When it penetrates an object, the penetration rate varies according to the density and composition of a material. Owing to this principle, X-ray radiography is widely used as a non-destructive inspection method in the industry. In other words, this system is used to inspect the inside of a sample by a non-destructive method. X-ray radiography can identify the shape of gold wire and lead frame and failure modes inside electronic components and detect defective copper wire and PTH on the printed circuit board. It can also identify void distribution in solder balls and soldering defects at SMT level by a non-destructive method.
Ball Short / Ball Neck Open / Wire Open / Package Crack

X-Ray Applications

  • PCB surface mount board
  • Semiconductor: BGA, CSP, Flip Chip, etc.
  • Electric and electronic components
  • Solder void measurement

SAT(Scanning Acoustic Tomography)

Scanning acoustic tomography (SAT or SAM) is a non-destructive failure analysis technique which uses high frequency ultrasonic energy to image internal features, characterize material properties and detect defects via an acoustic wave. It is used for detecting cracks, locations and size of delamination and chip inside electronic components. Scanning acoustic microscopy works by directing focused sound from a transducer at a small point on a target object. Sound hitting the object is either scattered, absorbed, reflected or transmitted. It is possible to detect the scattered pulses travelling in a particular direction. A detected pulse displays on the CRT screen and informs of the presence of a boundary or object.
Package & Chip Crack / Chip Crack & Delamination

SAT Applications

  • Identification of delamiation between package interfaces
  • Identification of cracks in internal chips
  • Measurement of internal chip size
  • a mode scan: Spot scan technique
  • b mode scan: Cross sectional scan technique
  • c mode scan: Face scan technique
  • t mode scan: Penetration scan technique
  • s mode scan: Diagonal scan technique