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고객 및 기술지원

신뢰성시험과 불량유형 분석

Failure mechanism
Reliability Test Method Standard Failure Mode Failure Mechanism
THB
HAST
U-HAST
MSL		 JESD22-A101
JESD22-A110
JESD22-A118
J-STD-020		 Open
Short
Leakage
Functional Failure
  • Aluminum Metal Corrosion
  • Electro Chemical Migration : Dendrite Growth, Conductive Anodic Filament
  • Passivation Damaged
  • Passivation Crack
  • Delamination between layers in die(wafer)
  • Delamination between package(mold compound) and die
  • Delamination between package(mold compound) and internal layer
  • Short by mobile ion caused by contamination or impurities
  • Pad Cratering
  • Whisker
TC
PTC
TS
PC
MSL		 JESD22-A104
JESD22-A105
JESD22-A106
JESD22-A113
J-STD-020		 Open
Functional Failure
  • Bond Ball Lift
  • Ball Neck Open
  • Stitch Bonding Open
  • Gold Wire Broken
  • Solder Bump Open
  • Passivation Damaged
  • Passivation Crack
  • Delamination between layers in die(wafer)
  • Delamination between package(mold compound) and die
  • Delamination between package(mold compound) and internal layer
  • Pad Cratering
  • Aluminum Slide Failure
  • Whisker
HTOL
HTS		 JESD22-A103
JESD22-A108		 Open
Leakage
Functional Failure
  • Bond ball lift by Kirkendall effect
  • Passivation Damage
  • Stress Migration
  • Mobile Ion Charge
  • Charge Loss
  • Aluminum Metal Corrosion
  • Oxide Breakdown
LTOL
LTS		 JESD22-A108
JESD22-A119		 Leakage
Functional Failure
  • Gate Oxide Breakdown
BL Drop
BL TC
Bending		 JESD22-B111
IPC9701
JESD22-B113 		Open
  • Solder Joint Crack
ESD HBM
ESD MM
ESD CDM
Latch-up		 (Commercial)
JS-001
JESD22-A115
JS-002
JESD78

(Automotive)
AEC-Q100-002
AEC-Q100-003
AEC-Q100-011
AEC-Q100-004		 Open
Short
Leakage
  • Contact Spike
  • Gate Oxide Break
  • Poly Melting
  • Metal Melting
TDDB JP001 Leakage
Functional Failure
  • Gate Oxide Breakdown
  • Oxide Breakdown