Failure Cause | Failure Machanism | Failure Mode | ||||||||
---|---|---|---|---|---|---|---|---|---|---|
Short | Open | Increase in leakage current |
Withstand voltage degradation |
VT, hFE Shift |
Unstable Operation |
Resistance functuation |
Increase in thermal resistance |
Insufflclent soldering |
||
Bulk, Board, diffusion, PN Junction, Isolation |
Crystal defect | ○ | ○ | ○ | ○ | ○ | ||||
Crack | ○ | ○ | ○ | ○ | ○ | ○ | ||||
Surface contamination | ○ | ○ | ○ | ○ | ○ | |||||
Junction degradation | ○ | ○ | ○ | |||||||
Impurity deposition | ○ | ○ | ○ | ○ | ||||||
Unadjustable mask | ○ | ○ | ○ | ○ | ○ | |||||
Gate oxide film | Movable ion | ○ | ○ | ○ | ○ | |||||
Interface level | ○ | ○ | ○ | ○ | ||||||
TDDB | ○ | ○ | ||||||||
Hot electron | ○ | ○ | ||||||||
Metallization, on-chip writing, through hole, contact |
Insufficlent adhesion strength | ○ | ○ | ○ | ||||||
Ohmic contact | ○ | ○ | ○ | |||||||
Stage cut | ○ | ○ | ○ | |||||||
Uneven thickness | ○ | |||||||||
Scar | ○ | ○ | ||||||||
Corrosion | ○ | ○ | ○ | ○ | ○ | |||||
Electromigration | ○ | ○ | ○ | |||||||
Al projection due to Al-Si alloy formation | ○ | ○ | ||||||||
Al shift due to mild force | ○ | ○ | ||||||||
Passivation, surface protective film, Inter-layer insulation film |
Pin hole | ○ | ○ | ○ | ○ | ○ | ||||
Crack | ○ | ○ | ○ | ○ | ○ | |||||
Uneven thickness (step coverage block) |
○ | ○ | ||||||||
Unstable physical characteristics of film | ○ | ○ | ○ | ○ | ||||||
Contamination | ○ | ○ | ○ | ○ | ○ | |||||
Surface Inversion | ○ | ○ | ○ | ○ | ○ | |||||
Die bonding | Crack(uneven force, vold) | ○ | ○ | ○ | ○ | ○ | ||||
Chip peeling (insufficient adhesion strength) | ○ | ○ | ○ | ○ | ||||||
Thermal fatigue | ○ | ○ | ○ | ○ | ||||||
Wire bonding | Substrate defect | ○ | ○ | |||||||
Removed bonding | ○ | ○ | ||||||||
Intermatallic compound generation | ○ | ○ | ||||||||
Damage and crack below bonding | ○ | ○ | ○ | ○ | ○ | |||||
Bonding positional shift | ○ | ○ | ||||||||
Loose wiring | ○ | |||||||||
Line break | ○ | |||||||||
Short between lines | ○ | |||||||||
Package, lead frame, resin, lead plating |
Moisture(resin bulk) | ○ | ○ | ○ | ○ | ○ | ||||
Moisture(resin interface) | ○ | ○ | ○ | ○ | ○ | |||||
Impure ion of resin | ○ | ○ | ○ | |||||||
Surface contamination | ○ | ○ | ○ | ○ | ||||||
Hardening force | ○ | ○ | ○ | ○ | ○ | |||||
Lead rust, oxidation | ○ | ○ | ○ | ○ | ○ | |||||
Lead break | ○ | |||||||||
Particle | ○ | ○ | ○ | ○ | ||||||
I/O pin | Static electricity | ○ | ○ | ○ | ○ | ○ | ||||
Overvoltage | ○ | ○ | ○ | ○ | ○ | ○ |