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불량발생원인 및 분석
| Failure Cause | Failure Machanism | Failure Mode | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|
| Short | Open | Increase in leakage current |
Withstand voltage degradation |
VT, hFE Shift |
Unstable Operation |
Resistance functuation |
Increase in thermal resistance |
Insufflclent soldering |
||
| Bulk, Board, diffusion, PN Junction, Isolation |
Crystal defect | ○ | ○ | ○ | ○ | ○ | ||||
| Crack | ○ | ○ | ○ | ○ | ○ | ○ | ||||
| Surface contamination | ○ | ○ | ○ | ○ | ○ | |||||
| Junction degradation | ○ | ○ | ○ | |||||||
| Impurity deposition | ○ | ○ | ○ | ○ | ||||||
| Unadjustable mask | ○ | ○ | ○ | ○ | ○ | |||||
| Gate oxide film | Movable ion | ○ | ○ | ○ | ○ | |||||
| Interface level | ○ | ○ | ○ | ○ | ||||||
| TDDB | ○ | ○ | ||||||||
| Hot electron | ○ | ○ | ||||||||
| Metallization, on-chip writing, through hole, contact |
Insufficlent adhesion strength | ○ | ○ | ○ | ||||||
| Ohmic contact | ○ | ○ | ○ | |||||||
| Stage cut | ○ | ○ | ○ | |||||||
| Uneven thickness | ○ | |||||||||
| Scar | ○ | ○ | ||||||||
| Corrosion | ○ | ○ | ○ | ○ | ○ | |||||
| Electromigration | ○ | ○ | ○ | |||||||
| Al projection due to Al-Si alloy formation | ○ | ○ | ||||||||
| Al shift due to mild force | ○ | ○ | ||||||||
| Passivation, surface protective film, Inter-layer insulation film |
Pin hole | ○ | ○ | ○ | ○ | ○ | ||||
| Crack | ○ | ○ | ○ | ○ | ○ | |||||
| Uneven thickness (step coverage block) |
○ | ○ | ||||||||
| Unstable physical characteristics of film | ○ | ○ | ○ | ○ | ||||||
| Contamination | ○ | ○ | ○ | ○ | ○ | |||||
| Surface Inversion | ○ | ○ | ○ | ○ | ○ | |||||
| Die bonding | Crack(uneven force, vold) | ○ | ○ | ○ | ○ | ○ | ||||
| Chip peeling (insufficient adhesion strength) | ○ | ○ | ○ | ○ | ||||||
| Thermal fatigue | ○ | ○ | ○ | ○ | ||||||
| Wire bonding | Substrate defect | ○ | ○ | |||||||
| Removed bonding | ○ | ○ | ||||||||
| Intermatallic compound generation | ○ | ○ | ||||||||
| Damage and crack below bonding | ○ | ○ | ○ | ○ | ○ | |||||
| Bonding positional shift | ○ | ○ | ||||||||
| Loose wiring | ○ | |||||||||
| Line break | ○ | |||||||||
| Short between lines | ○ | |||||||||
| Package, lead frame, resin, lead plating |
Moisture(resin bulk) | ○ | ○ | ○ | ○ | ○ | ||||
| Moisture(resin interface) | ○ | ○ | ○ | ○ | ○ | |||||
| Impure ion of resin | ○ | ○ | ○ | |||||||
| Surface contamination | ○ | ○ | ○ | ○ | ||||||
| Hardening force | ○ | ○ | ○ | ○ | ○ | |||||
| Lead rust, oxidation | ○ | ○ | ○ | ○ | ○ | |||||
| Lead break | ○ | |||||||||
| Particle | ○ | ○ | ○ | ○ | ||||||
| I/O pin | Static electricity | ○ | ○ | ○ | ○ | ○ | ||||
| Overvoltage | ○ | ○ | ○ | ○ | ○ | ○ | ||||