불량발생원인 및 분석<고객 및 기술지원<QRT


고객 및 기술지원

불량발생원인 및 분석

Failure Cause Failure Machanism Failure Mode
Short Open Increase
in leakage
current
Withstand
voltage
degradation
VT,
hFE Shift
Unstable
Operation
Resistance
functuation
Increase in
thermal
resistance
Insufflclent
soldering
Bulk,
Board,
diffusion,
PN Junction,
Isolation
Crystal defect
Crack
Surface contamination
Junction degradation
Impurity deposition
Unadjustable mask
Gate oxide film Movable ion
Interface level
TDDB
Hot electron
Metallization,
on-chip writing,
through hole,
contact
Insufficlent adhesion strength
Ohmic contact
Stage cut
Uneven thickness
Scar
Corrosion
Electromigration
Al projection due to Al-Si alloy formation
Al shift due to mild force
Passivation,
surface protective film,
Inter-layer insulation film
Pin hole
Crack
Uneven thickness
(step coverage block)
Unstable physical characteristics of film
Contamination
Surface Inversion
Die bonding Crack(uneven force, vold)
Chip peeling (insufficient adhesion strength)
Thermal fatigue
Wire bonding Substrate defect
Removed bonding
Intermatallic compound generation
Damage and crack below bonding
Bonding positional shift
Loose wiring
Line break
Short between lines
Package,
lead frame,
resin,
lead plating
Moisture(resin bulk)
Moisture(resin interface)
Impure ion of resin
Surface contamination
Hardening force
Lead rust, oxidation
Lead break
Particle
I/O pin Static electricity
Overvoltage