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신뢰성테스트 국제규격

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JEDEC STANDARDS
Document Number Content
JESD22-A100 Cycled Temperature-Humidity-Bias Life Test
JESD22-A101 Steady State Temperature Humidity Bias Life Test
JESD22-A102 Accelerated Moisture Resistance - Unbiased Autoclave
JESD22-A103 High Temperature Storage Life
JESD22-A104 Temperature Cycling
JESD22-A105 Power and Temperature Cycling
JESD22-A106 Thermal Shock
JESD22-A107 Salt Atmosphere
JESD22-A108 Temperature, Bias, and Operating Life
JESD22-A110 Highly-Accelerated Temperature and Humidity Stress Test (HAST)
JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices prior to Reliability Testing
JESD22-A115 Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)
JESD22-A117 ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
JESD22-A118 Accelerated Moisture Resistance -Unbiased HAST
JESD22-A119 Low Temperature Storage Life
JESD22-B101 External Visual
JESD22-B102 Solderability
JESD22-B103 Vibration, Variable Frequency
JESD22-B106 Resistance to Solder Shock for Through-Hole Mounted Devices
JESD22-B110 Mechanical Shock - Compont and Subassembly
JESD22-B111 Board Level Drop Test Method of Components for Handheld Electronic Products
JESD22-B113 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products
IPC/JEDEC J-STD-002 Solderability Test for Component Leads, Terminations, Lugs, Terminals and Wires
IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
ANSI/ESDA/JEDEC
JS-001
Human Body Model (HBM) - Component Level
ANSI/ESDA/JEDEC
JS-002
Charged Device Model (CDM) – Device Level
JEP122 Failure Mechanisms and Models for Semiconductor Devices
JESD47 Stress-Test-Driven Qualification of Integrated Circuits
JESD74 Early Life Failure Rate Calculation Procedure for Semiconductor Components
JESD78 IC Latch-Up Test
JESD226 RF BIASED LIFE (RFBL) TEST METHOD
AEC STANDARDS
Document Number Content
AEC-Q100 Stress Qualification For Integrated Circuits (with test methods)
AEC-Q101 Stress Test Qualification For Discrete Semiconductors
AEC-Q200 Stress Test Qualification For Passive Components (complete document with test methods)
AEC-Q005 Pb-Free Test Requirement
AEC-Q006 Qualification Requirements for Components using Copper Wire Interconnections
IEC STANDARDS
Document Number Content
IEC 60068 Environmental testing
IEC 60747 Semiconductor devices
IEC 60749 Semiconductor devices-Mechanical and climate test methods
IEC 60810 Lamps for road vehicles – Performance requirements