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신뢰성테스트 국제규격

큐알티반도체 신뢰성시험에 적용되는 스펙목록 입니다

JEDEC STANDARDS
Document Number Content
JESD22-A100 Cycled Temperature-Humidity-Bias Life Test
JESD22-A101 Steady State Temperature Humidity Bias Life Test
JESD22-A102 Accelerated Moisture Resistance - Unbiased Autoclave
JESD22-A103 High Temperature Storage Life
JESD22-A104 Temperature Cycling
JESD22-A105 Power and Temperature Cycling
JESD22-A106 Thermal Shock
JESD22-A107 Salt Atmosphere
JESD22-A108 Temperature, Bias, and Operating Life
JESD22-A110 Highly-Accelerated Temperature and Humidity Stress Test (HAST)
JESD22-A113 Preconditioning of Nonhermetic Surface Mount Devices prior to Reliability Testing
JESD22-A115 Electrostatic Discharge (ESD) Sensitivity Testing Machine Model (MM)
JESD22-A117 ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST
JESD22-A118 Accelerated Moisture Resistance -Unbiased HAST
JESD22-A119 Low Temperature Storage Life
JESD22-B101 External Visual
JESD22-B102 Solderability
JESD22-B103 Vibration, Variable Frequency
JESD22-B106 Resistance to Solder Shock for Through-Hole Mounted Devices
JESD22-B110 Mechanical Shock - Compont and Subassembly
JESD22-B111 Board Level Drop Test Method of Components for Handheld Electronic Products
JESD22-B113 Board Level Cyclic Bend Test Method for Interconnect Reliability Characterization of Components for Handheld Electronic Products
IPC/JEDEC J-STD-002 Solderability Test for Component Leads, Terminations, Lugs, Terminals and Wires
IPC/JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
ANSI/ESDA/JEDEC
JS-001		 Human Body Model (HBM) - Component Level
ANSI/ESDA/JEDEC
JS-002		 Charged Device Model (CDM) – Device Level
JEP122 Failure Mechanisms and Models for Semiconductor Devices
JESD47 Stress-Test-Driven Qualification of Integrated Circuits
JESD74 Early Life Failure Rate Calculation Procedure for Semiconductor Components
JESD78 IC Latch-Up Test
JESD226 RF BIASED LIFE (RFBL) TEST METHOD
AEC STANDARDS
Document Number Content
AEC-Q100 Stress Qualification For Integrated Circuits (with test methods)
AEC-Q101 Stress Test Qualification For Discrete Semiconductors
AEC-Q200 Stress Test Qualification For Passive Components (complete document with test methods)
AEC-Q005 Pb-Free Test Requirement
AEC-Q006 Qualification Requirements for Components using Copper Wire Interconnections
IEC STANDARDS
Document Number Content
IEC 60068 Environmental testing
IEC 60747 Semiconductor devices
IEC 60749 Semiconductor devices－Mechanical and climate test methods
IEC 60810 Lamps for road vehicles – Performance requirements